ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,417, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Integrated circuit device and electronic system including the same" was invented by Seokcheon Baek (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes a first structure and a second structure stacked on the first structure. The first structure includes a first substrate, a peripheral circuit, and a first bonding pad. The second structure includes a second substrate that includes a first side and a second side, a plurality of gate electrodes disposed on the first side of the second substrate, a first c...