US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Wiring material for semiconductor device, wiring for semiconductor device including the same, and semiconductor device including the wiring" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,058, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Wiring material for semiconductor device, wiring for semiconductor device including the same, and semiconductor device including the wiring" was invented by Joungeun Yoo (Seongnam-si, South Korea), Youngjae Kang (Suwon-si, South Korea) and Duseop Yoon (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device inclu...