US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Slurry arm and chemical mechanical polishing apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,515, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Slurry arm and chemical mechanical polishing apparatus including the same" was invented by Donghoon Kwon (Suwon-si, South Korea) and Ilyoung Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry arm is provided. The slurry arm includes: an arm body; a slurry line that extends through the arm body; an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line; a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber; and a main valve configured to...