US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Semiconductor package including underfill and method of forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,081, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including underfill and method of forming the same" was invented by Jinyoung Kim (Suwon-si, South Korea), Jiyeong Kim (Anyang-si, South Korea) and Okseon Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip on a lower structure. A first underfill is between the first semiconductor chip and the lower structure. The first underfill includes a first portion adjacent to a center region of the first semiconductor chip, and a second portion adjacent to an edge r...