US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Semiconductor package having pad pattern including plastically deformed metal film" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,996, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having pad pattern including plastically deformed metal film" was invented by Junghyun Lee (Hwaseong-si, South Korea), Junghoon Kang (Anyang-si, South Korea) and Hyunchul Jung (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor package includes forming a pad pattern including a metal film on a semiconductor chip; forming an insulating layer covering the pad pattern and including an organic insulating material; and forming an opening exposing a surface of the metal film of the pad...