ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,060, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jaeean Lee (Suwon-si, South Korea), Dahee Kim (Suwon-si, South Korea), Taehoon Lee (Suwon-si, South Korea) and Gyujin Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate having a first surface and a second surface, and having a cavity extending from the first surface to the second surface in a vertical direction, a first chip disposed in the cavity of the first substrate, a redistribution structure on the first surface of the first substrate, a se...