ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,087, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kwang-Soo Kim (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a substrate that includes a plurality of substrate pads on a top surface of the substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip, and a plurality of first bonding wires on a top surface of the first semiconductor chip and coupled to the substrate pads. The first semiconductor chip includes a first lower signal pad, a seco...