ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,038, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor device package" was invented by Younghwan Park (Seongnam-si, South Korea), Jongseob Kim (Seoul, South Korea), Jaejoon Oh (Seongnam-si, South Korea), Soogine Chong (Seoul, South Korea) and Sunkyu Hwang (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a lead frame, a semiconductor device including a first face connected to the lead frame, a second face that faces the first face, a gate pad, a drain pad, and a source pad, the gate pad exposed on the second face of the semiconductor, the ...