US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Electronic device with sealing structure" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,020, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device with sealing structure" was invented by Wontae Jeong (Suwon-si, South Korea), Eungkyu Park (Suwon-si, South Korea), Dongyeop Lee (Suwon-si, South Korea), Yonghwa Kim (Suwon-si, South Korea), Gihoon Lee (Suwon-si, South Korea), Jaehwan Lee (Suwon-si, South Korea), Seungbum Choi (Suwon-si, South Korea), Hyounggil Choi (Suwon-si, South Korea) and Changryong Heo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate ori...