US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "3D laminated chip, and semiconductor package including the 3D laminated chip" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,083, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"3D laminated chip, and semiconductor package including the 3D laminated chip" was invented by Eunseok Song (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) laminated chip that includes a first semiconductor chip including a first through electrode disposed therein. A second semiconductor chip is arranged horizontally adjacent to the first semiconductor chip. A third semiconductor chip is arranged on the first semiconductor chip and the second semiconductor chip. A size of the third semiconductor chip is greate...