ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,214, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hee Woo An (Seoul, South Korea), Kyung Suk Oh (Seongnam-si, South Korea) and Man ho Lee (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a first package including a memory chip having a memory cell, and a capacitor structure disposed independently of the memory chip; and a second package including a logic chip configured to access the memory cell, wherein the capacitor structure is electrically connected to the memory chip and the logic chip."
The patent was f...