ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,107, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Mounting device and mounting method" was invented by Daisuke Nagatomo (Kanagawa, Japan), Fumitaka Moroishi (Kanagawa, Japan), Masanori Izumita (Kanagawa, Japan), Shinji Ueyama (Kanagawa, Japan), Takahiro Tokumiya (Kanagawa, Japan), Takamasa Sugiura (Kanagawa, Japan), Tatsuya Ishimoto (Kanagawa, Japan) and Masato Kajinami (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system...