US Patent Issued to SAMSUNG ELECTRONICS on Dec. 16 for "Method of manufacture of fan-out type semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,130, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method of manufacture of fan-out type semiconductor package" was invented by Sehoon Jang (Hwaseong-si, South Korea) and Sangkyu Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacture for a semiconductor package includes; forming a first wiring structure, connecting a semiconductor chip to the first wiring structure, forming a lower encapsulant on the first wiring structure to cover at least a portion of a lateral surface of the semiconductor chip, wherein the lower encapsulant does not cover an upper surface of th...