US Patent Issued to SAMSUNG ELECTRONICS on Aug. 5 for "Thin film structure including dielectric material layer and electronic device employing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,644, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Thin film structure including dielectric material layer and electronic device employing the same" was invented by Taehwan Moon (Suwon-si, South Korea), Jinseong Heo (Suwon-si, South Korea), Sangwook Kim (Suwon-si, South Korea) and Yunseong Lee (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a thin film structure and an electronic device including the same. The disclosed thin film structure includes a dielectric material layer between a first material layer and a second material layer. The dielectric material layer includ...