ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,185, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor packages" was invented by Juhyeon Kim (Cheonan-si, South Korea), Hyoeun Kim (Cheonan-Si, South Korea) and Sunkyoung Seo (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a redistribution substrate, a first semiconductor chip on the redistribution substrate, and a second semiconductor chip between the redistribution substrate and the first semiconductor chip. The second semiconductor chip may have a width in a first direction that is smaller than a width of the first semiconductor chip in...