US Patent Issued to SAMSUNG ELECTRONICS on Aug. 5 for "Semiconductor package and fabricating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,172, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and fabricating method thereof" was invented by Dae Hee Lee (Cheonan-si, South Korea), Tae-Ho Ko (Cheonan-si, South Korea) and Jun Woo Myung (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first redistribution layer; a first semiconductor chip including a first side and a second side, wherein the first side faces the first redistribution layer; a first sealing material covering the second side of the first semiconductor chip and having a first filler content; a second sealing m...