ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,130, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Gyuho Kang (Cheonan-si, South Korea), Jongho Park (Cheonan-si, South Korea), Seong-Hoon Bae (Cheonan-si, South Korea), Jeonggi Jin (Seoul, South Korea), Ju-Il Choi (Seongnam-si, South Korea) and Atsushi Fujisaki (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first redistribution substrate, a semiconductor chip on a top surface of the first redistribution substrate, a conductive structure on the top surface of the first redistribution substrate and laterally spa...