ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,184, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hyemi Kang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate having a first side portion adjacent to a first edge, and a second side portion adjacent to a second edge opposite the first edge; a plurality of first substrate pads on the package substrate at the first side portion of the package substrate; a first chip on the package substrate; a second chip stacked on the first chip in a step-wise manner to result in a first exposure region exposi...