US Patent Issued to SAMSUNG ELECTRONICS on Aug. 5 for "Redistribution substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,156, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Redistribution substrate and semiconductor package including the same" was invented by Hyeonjeong Hwang (Cheonan-si, South Korea), Dongkyu Kim (Anyang-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea) and Wonjae Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A redistribution substrate may include a first interconnection layer having a first insulating pattern, a first dummy pattern and a second dummy pattern, the first and second dummy patterns being in the first insulating pattern, and a second interconnection layer stacke...