US Patent Issued to SAMSUNG ELECTRONICS on Aug. 5 for "Light emitting device substrate and light emitting device package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,762, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Light emitting device substrate and light emitting device package including the same" was invented by Changhoon Kwak (Hwaseong-si, South Korea), Moonsub Kim (Suwon-si, South Korea), Seokman Cho (Seoul, South Korea), Myoungsun Ha (Suwon-si, South Korea) and Sujong Han (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device substrate includes an insulating layer, a plurality of upper pads spaced apart from each other in a matrix pattern on the insulating layer, a first circuit pattern inside the insulating layer, the first...