US Patent Issued to SAMSUNG ELECTRONICS on Aug. 5 for "Layout design method and method of manufacturing integrated circuit device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,380,266, issued on Aug. 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Layout design method and method of manufacturing integrated circuit device using the same" was invented by Dawoon Choi (Suwon-si, South Korea), Inseop Lee (Suwon-si, South Korea), Hee Jeong (Suwon-si, South Korea), Bongkeun Kim (Suwon-si, South Korea) and Myungsoo Noh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a layout design method including designing a preliminary layout including a source/drain contact pattern of an integrated circuit device, designing a first layout including a cut pattern for cutting the source/dra...