US Patent Issued to SAMSUNG ELECTRONICS on Aug. 26 for "Semiconductor package including electromagnetic shield structure" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,970, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including electromagnetic shield structure" was invented by Jongwan Kim (Cheonan-si, South Korea), Yongkwan Lee (Hwaseong-si, South Korea), Kyonghwan Koh (Anyang-si, South Korea), Seunghwan Kim (Anyang-si, South Korea), Jungjoo Kim (Hwaseong-si, South Korea), Junwoo Park (Anyang-si, South Korea) and Taejun Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a package substrate, a semiconductor chip on the package substrate, an electromagnetic shield structure on the package substra...