ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,978, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Seho You (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip comprising an active surface and an inactive surface facing each other. At least one antenna module is arranged adjacent to the semiconductor chip. The at least one antenna module comprises a main antenna and a sub-antenna. A redistribution structure is disposed on the semiconductor chip and the at least one antenna module. The redistribution structure electrically connects the active surfa...