ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,847, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Memory device including processing circuit, and electronic device including system on chip and memory device" was invented by Sang-Hyuk Kwon (Seoul, South Korea), Nam Sung Kim (Yongin-si, South Korea), Kyomin Sohn (Yongin-si, South Korea) and Jaeyoun Youn (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a buffer die configured to receive a first broadcast command a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first c...