US Patent Issued to SAMSUNG ELECTRONICS on Aug. 26 for "Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same" (California Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,002, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same" was invented by Brian Kim (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a fro...