US Patent Issued to SAMSUNG ELECTRONICS on Aug. 19 for "Semiconductor package including a heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,687, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a heat dissipation structure" was invented by Yunhyeok Im (Hwaseong-si, South Korea) and Youngsang Cho (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate, a semiconductor chip disposed on the first substrate, a mold layer disposed on the first substrate and at least partially covering the semiconductor chip, and a heat dissipation structure disposed on a first top surface of the semiconductor chip and in the mold layer. The heat dissipation structure co...