ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,708, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Myungsam Kang (Hwaseong-si, South Korea), Youngchan Ko (Seoul, South Korea), Jeongseok Kim (Cheonan-si, South Korea) and Bongju Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first redistribution structure having a first surface and a second surface opposing the first surface, and including a first insulating layer and a first redistribution layer disposed on the first insulating layer; a semiconductor chip disposed on the first surface of the first red...