ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,738, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Young Lyong Kim (Anyang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a package substrate, a substrate on the package substrate, a first semiconductor chip mounted on the substrate, and a stiffener structure on the package substrate and having a hole. The stiffener structure is laterally spaced apart from the substrate. The hole penetrates a top surface of the stiffener structure and a bottom surface of the stiffener structure. When viewed in plan, the h...