US Patent Issued to SAMSUNG ELECTRONICS on Aug. 19 for "Semiconductor device including interconnect structure with metal bridge pattern connecting adjacent metal lines" (New York, Virginia Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,704, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including interconnect structure with metal bridge pattern connecting adjacent metal lines" was invented by Jaemyung Choi (Niskayuna, N.Y.), Johnsoo Kim (Clifton Park, N.Y.), Joongsuk Oh (Watervilet, N.Y.) and Kang-ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device which includes: a base layer; a 1st metal line and a 2nd metal extended in a 1st direction and arranged in a 2nd direction, intersecting the 1st direction, in a 1st layer above the base layer; and a bridge metal patter...