US Patent Issued to SAMSUNG ELECTRONICS on Aug. 19 for "Optical proximity correction method, mask manufacturing method and semiconductor chip manufacturing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,123, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Optical proximity correction method, mask manufacturing method and semiconductor chip manufacturing method using the same" was invented by Wonjoo Im (Yongin-si, South Korea), Noyoung Chung (Hwaseong-si, South Korea) and Sanghwa Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor chip includes designing a layout for a semiconductor chip, performing an optical proximity correction (OPC) on the layout, manufacturing a mask after performing the OPC, and manufacturing the semiconductor chip using the ...