ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,641, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Molding apparatus of semiconductor package" was invented by Jinwoo Park (Suwon-si, South Korea), Myungsung Kang (Suwon-si, South Korea), Jaekyung Yoo (Suwon-si, South Korea), Unbyoung Kang (Suwon-si, South Korea) and Chungsun Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A molding apparatus for a semiconductor package includes a chamber including a lower mold configured to hold a substrate including a plurality of molding targets, an upper mold configured to move up and down with respect to the lower mold and define a cavity bet...