ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,666, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing a semiconductor device" was invented by Yongmin Kim (Hwaseong-si, South Korea), Moonjong Kang (Yongin-si, South Korea), Miyoun Kim (Seongnam-si, South Korea), Sungil Moon (Suwon-si, South Korea), Jongsu Park (Hwaseong-si, South Korea), Heonju Lee (Hwaseong-si, South Korea) and Sunkak Jo (Ansan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to example embodiments, a method of manufacturing a semiconductor device is provided. The method includes forming an etching target layer on a substrate; forming a first ...