US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Semiconductor package including redistribution substrate and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,040, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including redistribution substrate and method of manufacturing the same" was invented by Seokhyun Lee (Hwaseong-si, South Korea), Dongkyu Kim (Anyang-si, South Korea), Kyounglim Suk (Suwon-si, South Korea) and Hyeonjeong Hwang (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate including a conductive structure having a lower conductive pattern and a redistribution structure electrically connected to the lower conductive pattern, on the lower conductive ...