US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Semiconductor package including redistribution pattern" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,000, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including redistribution pattern" was invented by Dahee Kim (Cheonan-si, South Korea) and Gookmi Song (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip including a connecting pad, a mold layer covering the semiconductor chip, a lower redistribution layer on the semiconductor chip and the mold layer, and a connecting terminal on the lower redistribution layer. The lower redistribution layer includes a first lower insulating layer, a first conformal redistri...