US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Semiconductor package comprising heat spreader" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,048, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor package comprising heat spreader" was invented by Sungeun Jo (Hwaseong-si, South Korea), Youngdeuk Kim (Hwaseong-si, South Korea), Jaechoon Kim (Incheon, South Korea), Taehwan Kim (Hwaseong-si, South Korea) and Kyungsuk Oh (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip, in which a horizontal width of e...