ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,029, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Choongbin Yim (Seoul, South Korea), Jihwang Kim (Cheonan-si, South Korea), Jongbo Shim (Asan-si, South Korea) and Jinwoo Park (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first package substrate having a lower surface and an upper surface respectively including a plurality of first lower surface pads and a plurality of first upper surface pads, a second package substrate having a lower surface and an upper surface respectively including a plurality of second low...