ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,046, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hongwon Kim (Suwon-si, South Korea), Junmo Koo (Hwaseong-si, South Korea), Yeonjoo Kim (Seoul, South Korea), Yunhee Kim (Hwaseong-si, South Korea), Jongkook Kim (Suwon-si, South Korea), Doohwan Lee (Cheonan-si, South Korea) and Jeongho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips disposed on the interposer package, the interposer package includes...