US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,963, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the same" was invented by Jiyoung Chu (Gyeongju-si, South Korea), Hyungjin Kim (Suwon-si, South Korea), Minhwan Seo (Hwaseong-si, South Korea), Wondon Joo (Incheon, South Korea), Sungmin Ahn (Suwon-si, South Korea), Jiyoung Kim (Hwaseong-si, South Korea), Ono Kazuya (Suwon-si, South Korea) and Jungchul Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical apparatus includes a folding mirror confi...