US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Electronic device housing with protrusions and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,921, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device housing with protrusions and electronic device including the same" was invented by Hangyu Hwang (Gyeonggi-do, South Korea), Changsu Kim (Gyeonggi-do, South Korea), Sangsik Na (Gyeonggi-do, South Korea), Yeonghwan Gong (Gyeonggi-do, South Korea), Hyunjung Jung (Gyeonggi-do, South Korea), Sungho Cho (Gyeonggi-do, South Korea), Junpil Kim (Gyeonggi-do, South Korea), Jinho Kim (Gyeonggi-do, South Korea), Jinshik Lim (Gyeonggi-do, South Korea) and Jungho Hwang (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According t...