US Patent Issued to SAMSUNG ELECTRONICS on Aug. 12 for "Cooling device semiconductor device including end curved interconnection lines" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,676, issued on Aug. 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Cooling device semiconductor device including end curved interconnection lines" was invented by Minjae Jeong (Yongin-si, South Korea), Jungho Do (Hwaseong-si, South Korea), Jae-Woo Seo (Seoul, South Korea), Jisu Yu (Seoul, South Korea) and Hyeongyu You (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include a substrate including a first logic cell and a second logic cell, which are adjacent to each other in a first direction and shares a cell border, a first metal layer on the substrate, the first metal l...