US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Semiconductor package including semiconductor chips stacked via conductive bumps" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,661, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including semiconductor chips stacked via conductive bumps" was invented by Eunsu Lee (Asan-si, South Korea), Dongho Kim (Asan-si, South Korea), Jiyong Park (Asan-si, South Korea) and Jeonghyun Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a des...