US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Semiconductor package having interposer substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,628, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having interposer substrate" was invented by Yanggyoo Jung (Gwangmyeong-si, South Korea), Seungbin Baek (Suwon-si, South Korea), Hyunjung Song (Hwaseong-si, South Korea) and Sangmin Yong (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a first wiring pad on a package substrate; a first wiring connection part on the first wiring pad and including a wiring solder layer; a second wiring pad on the package substrate; a second wiring connection part on the second wiring ...