US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,665, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Yongho Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first semiconductor device including a first pad and a first metal bump structure on the first pad; and a second semiconductor device on the first semiconductor device, and including a third pad and a second metal bump structure on the third pad, wherein the first and second metal bump structures are bonded to each other to electrically connect th...