US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,666, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Eunsil Kim (Cheonan-si, South Korea), Seunghan Sim (Incheon, South Korea) and Gun Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes forming an insulating layer; forming a seed layer on the insulating layer; forming a photoresist layer on the seed layer; forming a plurality of line pattern holes by patterning the photoresist layer, a horizontal length of a middle portion of each of the plurality of line patter...