ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,652, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Jiwon Shin (Daejeon, South Korea), Donguk Kwon (Asan-si, South Korea), Kwang Bok Woo (Cheonan-si, South Korea) and Minseung Ji (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first sub-semiconductor device, an interposer, and a second sub-semiconductor device stacked on each other, and a heat sink covering the second sub-semiconductor device. The first sub-semiconductor device includes a first substrate and a first semiconductor chip. The interposer includes a d...