US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,040, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board" was invented by Hyelim Yun (Suwon-si, South Korea), Bongkyu Min (Suwon-si, South Korea), Dohoon Kim (Suwon-si, South Korea), Taewoo Kim (Suwon-si, South Korea), Jinyong Park (Suwon-si, South Korea), Jungje Bang (Suwon-si, South Korea) and Hyeongju Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer su...