ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,743, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Junwoo Park (Asan-si, South Korea), Seunghwan Kim (Asan-si, South Korea), Jungjoo Kim (Daegu, South Korea), Yongkwan Lee (Gyeonggi-do, South Korea) and Dongju Jang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower substrate that includes a lower wiring layer; a semiconductor chip disposed on the lower substrate, and an upper substrate disposed on the semiconductor chip. The upper substrate includes a lower surface that faces the semiconductor chip, an upp...