ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,745, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Donguk Kwon (Asan-si, South Korea), Wooram Myung (Suwon-si, South Korea), Jiwon Shin (Daejeon, South Korea) and Pilsung Choi (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower substrate having a chip mounting region, an interconnection region surrounding the chip mounting region, and an outer region surrounding the interconnection region, and includes a lower wiring layer. A first solder resist pattern has first openings exposing bonding regions of the lowe...