ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,780, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Ju-Youn Choi (Hwaseong-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea) and Wonjae Lee (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including: a package substrate; an interposer on the package substrate; a chip stack on the interposer, the chip stack including a plurality of first semiconductor chips that are stacked in a first direction; a second semiconductor chip on the interposer and spaced apart from the chip stack in a second direction intersecting the fi...