ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,837, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor light emitting device package" was invented by Junghun Lee (Suwon-si, South Korea), Kyoungjun Kim (Yongin-si, South Korea) and Seolyoung Choi (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ce...